During the first Quarter 2008 the Leitronic AG has moved into the new manufacturing area combined with SMD-placement. The vantages are that we are more flexible to customer demands and that we are more independent from placement suppliers.
For the SMD-placement three new machines are required:

1. Semi Automatic Printer: The printer puts the solder trough a stencil onto the conductor board.

2. Pick and Place system: With the pick and place system the small SMD-components will be placed exactly at the position with solder from the printer. The SMD-components are stored in rolls. The rolls are placed around the pick and place system.

3. Reflow oven: The conductor board fitted with SMD-components will be heated in three zones. In the third zone the solder melts and make a durable connection between conductor board and the SMD-components.

Course of instruction by Swiss company Essemtec: The course took one week and it was amazing what we accomplished in this time. At the end we produced already LMK and bébétels.